{"title":"使用全跟踪分析简化根本原因分析","authors":"M. Yelverton, T. Ho, Joe Lee","doi":"10.1109/issm.2018.8651175","DOIUrl":null,"url":null,"abstract":"In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals allowing fab engineers to accurately pinpoint the root causes of yield-impacting issues. This paper highlights several use cases illustrating how advanced full trace analytics can help not only in providing accurate results, but also in simplifying the root cause analysis process and reducing time-to-root-cause.","PeriodicalId":262428,"journal":{"name":"2018 International Symposium on Semiconductor Manufacturing (ISSM)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Using Full Trace Analytics to Simplify Root Cause Analysis\",\"authors\":\"M. Yelverton, T. Ho, Joe Lee\",\"doi\":\"10.1109/issm.2018.8651175\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals allowing fab engineers to accurately pinpoint the root causes of yield-impacting issues. This paper highlights several use cases illustrating how advanced full trace analytics can help not only in providing accurate results, but also in simplifying the root cause analysis process and reducing time-to-root-cause.\",\"PeriodicalId\":262428,\"journal\":{\"name\":\"2018 International Symposium on Semiconductor Manufacturing (ISSM)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International Symposium on Semiconductor Manufacturing (ISSM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/issm.2018.8651175\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on Semiconductor Manufacturing (ISSM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/issm.2018.8651175","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Using Full Trace Analytics to Simplify Root Cause Analysis
In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals allowing fab engineers to accurately pinpoint the root causes of yield-impacting issues. This paper highlights several use cases illustrating how advanced full trace analytics can help not only in providing accurate results, but also in simplifying the root cause analysis process and reducing time-to-root-cause.