使用全跟踪分析简化根本原因分析

M. Yelverton, T. Ho, Joe Lee
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引用次数: 1

摘要

在半导体制造中,使用FDC摘要数据的传统根本原因分析并不总是有效地解决复杂问题,特别是当缺陷信号太微妙而无法检测时。全跟踪分析可以发现这些隐藏的信号,使晶圆厂工程师能够准确地找出影响产量问题的根本原因。本文重点介绍了几个用例,说明了先进的完整跟踪分析不仅可以提供准确的结果,还可以简化根本原因分析过程并减少找到根本原因的时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Using Full Trace Analytics to Simplify Root Cause Analysis
In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals allowing fab engineers to accurately pinpoint the root causes of yield-impacting issues. This paper highlights several use cases illustrating how advanced full trace analytics can help not only in providing accurate results, but also in simplifying the root cause analysis process and reducing time-to-root-cause.
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