电子设计交换格式EDIF:现在与未来

[1992] Proceedings 29th ACM/IEEE Design Automation Conference Pub Date : 1992-07-01 DOI:10.1109/DAC.1992.227802

H. J. Kahn, R. Goldman

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引用次数: 21

摘要

本文综述了电子设计交换格式(EDIF)的现状和发展趋势。EDIF现在是传输连接性和示意图数据的主要机制。然而，真正的实际问题是存在的，并且正在得到解决。本文回顾了出现的一些困难，并讨论了一些解决办法。介绍了一些正在开发的新想法，以包含在新版本的EDIF (Version 2.1)中。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The Electronic Design Interchange Format EDIF: present and future

The authors review the present status and current developments of the Electronic Design Interchange Format, EDIF. EDIF is now the primary mechanism for transfer of connectivity and schematic data. However, real practical problems exist and are being tackled. Some of the difficulties that have arisen are reviewed and some solutions are discussed. Some of the new ideas being developed for inclusion in the new release of EDIF (Version 2 1 0) are introduced.<>

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[1992] Proceedings 29th ACM/IEEE Design Automation Conference

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