{"title":"客户对完美设计和制造的PQFP封装的期望是什么?","authors":"A.A. Shinohara","doi":"10.1109/IEMT.1991.279748","DOIUrl":null,"url":null,"abstract":"It is pointed out that customers of semiconductor packaged devices have strongly requested new, advanced SMDs which meet their requirements. Semiconductor manufacturers have made great efforts to develop and manufacture new semiconductor packages. They have endeavored to satisfy even unreasonable demands. The main reasons for the ability of Japanese semiconductor manufacturers to continue as they do now are described. In addition, mismatches of PQFP (plastic quad flat pack) package design between the Electronics Industry Association in Japan and the Joint Electronics Devices Engineering Council are considered. It is noted that the current situation cannot be considered desirable from a standardization point of view.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"What does the customer expect from a perfectly designed and manufactured PQFP package?\",\"authors\":\"A.A. Shinohara\",\"doi\":\"10.1109/IEMT.1991.279748\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is pointed out that customers of semiconductor packaged devices have strongly requested new, advanced SMDs which meet their requirements. Semiconductor manufacturers have made great efforts to develop and manufacture new semiconductor packages. They have endeavored to satisfy even unreasonable demands. The main reasons for the ability of Japanese semiconductor manufacturers to continue as they do now are described. In addition, mismatches of PQFP (plastic quad flat pack) package design between the Electronics Industry Association in Japan and the Joint Electronics Devices Engineering Council are considered. It is noted that the current situation cannot be considered desirable from a standardization point of view.<<ETX>>\",\"PeriodicalId\":127257,\"journal\":{\"name\":\"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-09-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1991.279748\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1991.279748","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
What does the customer expect from a perfectly designed and manufactured PQFP package?
It is pointed out that customers of semiconductor packaged devices have strongly requested new, advanced SMDs which meet their requirements. Semiconductor manufacturers have made great efforts to develop and manufacture new semiconductor packages. They have endeavored to satisfy even unreasonable demands. The main reasons for the ability of Japanese semiconductor manufacturers to continue as they do now are described. In addition, mismatches of PQFP (plastic quad flat pack) package design between the Electronics Industry Association in Japan and the Joint Electronics Devices Engineering Council are considered. It is noted that the current situation cannot be considered desirable from a standardization point of view.<>