通过临界区分析进行可靠性预测

IEEE 1995 International Integrated Reliability Workshop. Final Report Pub Date : 1995-10-22 DOI:10.1109/IRWS.1995.493604

J.H.N. Mattick, R. Kelsall, R. Miles

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引用次数: 1

摘要

关键区域(CA)分析可用于集成电路制造后可靠性的预测。然而，预测的准确性依赖于所选缺陷模型的有效性。比较，突出这一选择的重要性，作出了结果之间使用两个不同形状的模型。最后，提出了一种新的结构CA分析方法，该方法可以快速准确地计算布局结构CA。

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Reliability prediction through critical area analysis

Critical Area (CA) analysis can be applied to the prediction of post-fabrication reliability of integrated circuits. However, the accuracy of the prediction is dependent on the validity of the chosen defect model. A comparison, highlighting the importance of this selection, is made between the results obtained using two differently shaped models. In conclusion, a novel CA analysis technique is outlined, which provides both quick and accurate computation of layout CA.

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IEEE 1995 International Integrated Reliability Workshop. Final Report

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