使用金属或有机焊盘涂层改善金属焊盘上微凸起的焊料润湿性

2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) Pub Date : 2017-10-01 DOI:10.1109/S3S.2017.8309263

I. de Preter, L. Hou, J. Derakhshandeh, P. Bex, F. Fodor, V. Cherman, K. Rebibis, Andy Miller

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引用次数: 0

摘要

本文研究了在热压键合(TCB)过程中，在电热试验车上80°C条件下等效10年的退火条件下，Au、NiB或浸入式Sn等薄化学金属层或自组装单层(SAM)等薄有机层在Cu、Co和Ni UBM微凸点上的钝化效果。用x -切片扫描电镜进行表征，以观察润湿性和接头形成，并进行电阻测量以确定产量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings

In this paper the passivation effect of thin electroless metallic layers such as Au, NiB or Immersion Sn or thin organic layers such as Self Assembled Monolayer (SAM) on Cu, Co and Ni UBM microbumps is studied during Thermo-Compression-Bonding (TCB) and after anneal with conditions that were identified to be equal to 10 years working device at 80°C on an electrical test vehicle. Characterization with X-section SEM is done to look at the wettability and joint formation and electrical resistance measurement are performed to determine the yield.

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2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

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