通过迁移增强外延减少砷化镓中Be的扩散,以及热处理对电活化和迁移率的影响

B. Tadayon, S. Tadayon, W. Schaff, M. Spencer, G. Harris, J. Griffin, P. Tasker, C. Wood, L. Eastman
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摘要

研究表明,迁移增强外延(MEE)方法可以在低衬底温度下生长高质量的砷化镓。退火后的MEE层具有与MBE(分子束外延)层相当的空穴浓度迁移率、表面形貌和光学特性。由于相对于MBE层,MEE法在退火MEE层中的Be扩散减少,因此可以取代传统的MBE法,用于需要高空穴浓度和小Be扩散的器件应用。随着退火时间的延长,孔板密度逐渐增大,达到一定的终值。较高的退火温度会在较短的退火时间内产生较高的电活化。对于低于1000℃的退火,随着退火温度的升高,电活化单调增加。退火时间为15 s时,孔片和迁移率峰分别在1000℃和900℃退火。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reduction of Be diffusion in GaAs by migration enhanced epitaxy, and the effect of heat treatment on the electrical activation and mobility
It has been demonstrated that the migration-enhanced epitaxy (MEE) method can be used to grow high-quality GaAs at low substrate temperature. Annealed MEE layers are shown to have hole concentration mobility, surface morphology, and optical characteristics comparable to those of MBE (molecular beam epitaxy) layers. Because of the reduction of Be diffusion in annealed MEE layers, relative to MBE layers, the MEE method can replace the conventional MBE method for device applications which require high hole concentration with small Be diffusion. As the anneal time increases, the hole sheet density increases and reaches some final value. A higher anneal temperature results in high electrical activation in a shorter anneal time. For annealing below 1000 degrees C, the electrical activation monotonically increases as the anneal temperature increases. For 15-s anneal time, the hole sheet and the mobility peak at the anneal temperatures of 1000 and 900 degrees C, respectively.<>
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