{"title":"VLSI封装可靠性研讨会报告","authors":"Daniel D. Zimmermant, H. Schafft","doi":"10.1109/IRPS.1983.362005","DOIUrl":null,"url":null,"abstract":"This will no longer be the case as we enter the world of VLSI. As the semiconductor industry has continued to design more circuitry into smaller areas in the pursuit of the economics of scale and as these circuits have become capable of greater performance, the impact of the package on product performance and reliability will increase dramatically. The magnitude of this impact is only gradually being recognized by the industry.","PeriodicalId":334813,"journal":{"name":"21st International Reliability Physics Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1983-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"VLSI Package Reliability Workshop Report\",\"authors\":\"Daniel D. Zimmermant, H. Schafft\",\"doi\":\"10.1109/IRPS.1983.362005\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This will no longer be the case as we enter the world of VLSI. As the semiconductor industry has continued to design more circuitry into smaller areas in the pursuit of the economics of scale and as these circuits have become capable of greater performance, the impact of the package on product performance and reliability will increase dramatically. The magnitude of this impact is only gradually being recognized by the industry.\",\"PeriodicalId\":334813,\"journal\":{\"name\":\"21st International Reliability Physics Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1983-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"21st International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1983.362005\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"21st International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1983.362005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This will no longer be the case as we enter the world of VLSI. As the semiconductor industry has continued to design more circuitry into smaller areas in the pursuit of the economics of scale and as these circuits have become capable of greater performance, the impact of the package on product performance and reliability will increase dramatically. The magnitude of this impact is only gradually being recognized by the industry.
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