2.5 Gbps ib铜缆互连兼容性

Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI:10.1109/EPEP.2004.1407548

I. Birkeli

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引用次数: 0

摘要

这项工作将重点放在电路板设计人员在通过铜电缆实现2.5 Gbps Infiniband板对板电气互连时面临的问题上。要符合规范，在低成本，大批量封装，使用标准的FR4 PCB技术，可能是一个很大的挑战。

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2.5 Gbps Infiniband copper cable interconnect compliance

This work puts a focus on the problems facing a board designer when implementing 2.5 Gbps Infiniband board to board electrical interconnect via a copper cable. To be compliant to specification, in low-cost, high volume packaging, using standard FR4 PCB technology, may be a great challenge.

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Electrical Performance of Electronic Packaging - 2004

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