超薄SOI N-和p - mosfet的低场迁移率:对超短mosfet性能的测量和影响

D. Esseni, M. Mastrapasqua, G. Celler, F. Baumann, C. Fiegna, L. Selmi, E. Sangiorgi
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引用次数: 89

摘要

利用一种能够规避寄生电阻效应的特殊测试结构,在不同温度下测量了超薄SOI N-和p - mosfet的电子和空穴有效迁移率。在大反转密度(N/sub - inv/)下,超薄SOI的迁移率可以比重掺杂的大块MOS高,因为有效场较低,并且对硅厚度(T/sub - SI/)基本不敏感。然而,在较小的Ni/sub inv/下,随着T/sub SI/的减小,迁移率明显降低。利用有效迁移率数据在器件仿真层面研究了对超短MOS晶体管性能的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low field mobility of ultra-thin SOI N- and P-MOSFETs: Measurements and implications on the performance of ultra-short MOSFETs
Electron and hole effective mobilities of ultra-thin SOI N- and P-MOSFETs have been measured at different temperatures using a special test structure able to circumvent parasitic resistance effects. At large inversion densities (N/sub inv/) ultra-thin SOI mobility can be higher than in heavily doped bulk MOS due a lower effective field and it is largely insensitive to silicon thickness (T/sub SI/). However, at small Ni/sub inv/ the mobility is clearly reduced for decreasing T/sub SI/. The effective mobility data are used to study the implications for ultra-short MOS transistor performance at device simulation level.
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