光学声子散射对超高速GaN晶体管性能极限的影响

T. Fang, Ronghua Wang, Guowang Li, H. Xing, S. Rajan, D. Jena
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引用次数: 1

摘要

随着GaN hemt的规模缩小,将性能推至100 GHz范围,研究其性能限制是及时的。与Si mosfet和大多数其他III-V型半导体hemt不同,GaN中的电子-极性光学声子相互作用特别强。因此,GaN中热电子的平均自由程为λop ~ 3.5nm,远短于典型的HEMT栅极长度(Lg)。因此,虽然Si mosfet和其他III-V hemt可以通过减少寄生延迟和Lg来接近弹道行为,但GaN hemt的情况却截然不同。在这里,我们通过将极性光学声子后向散射的影响纳入准弹道模型来研究GaN hemt的内在性能极限。然后,我们纳入寄生元素并定量研究性能的退化。所使用的方法是半解析的,将被证明对设计未来几代设备非常有帮助。这项工作不仅为扩展到高速设置了路线图,还为在最先进的GaN hemt中观察到的一些无法解释的特征提供了明确的物理原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of optical phonon scattering on the performance limits of ultrafast GaN transistors
As GaN HEMTs are scaled down to push performance into 100's of GHz range, it is timely to investigate their performance limits. Unlike Si MOSFETs and most other III–V semiconductor based HEMTs, the electron - polar optical phonon interaction is exceptionally strong in GaN. As a result, the mean free path of hot electrons in GaN is λop ∼ 3.5nm, far shorter than typical HEMT gate lengths (Lg). Thus while Si MOSFETs and other III-V HEMTs can approach near ballistic behavior by reduction of parasitic delays and Lg, the situation is starkly different for GaN HEMTs. Here, we investigate the intrinsic performance limits of GaN HEMTs by incorporating the effect of polar optical phonon backscattering into a quasi-ballistic model. Then, we include parasitic elements and quantitatively investigate the degradation in performance. The method used is semi-analytical, and will prove very helpful in designing future generations of devices. The work not only sets a roadmap for scaling to high speeds, it also offers clear physical reasons for a number of unexplained features observed in state-of-the-art GaN HEMTs.
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