{"title":"用于超高速数字电路的高密度球栅阵列封装的宽带模型","authors":"B. Yassini, S. Safavi-Naeini, T. Manku","doi":"10.1109/ANTEM.2000.7851748","DOIUrl":null,"url":null,"abstract":"This paper presents an efficient method for modeling of interconnecting circuit in Super Ball Grid Array (SBGA) packages. The model is based on physical segmentation and electromagnetic (EM) analysis of each segment. An equivalent circuit model based on EM analysis is developed for each segment and connecting individual segment models completes the final model. For verification and calibration the scattering parameters of the resulting model is first compared with EM analysis of important substructure and also with experimental data from a test package. Initial results show good agreement with measurement up to 15GHz‥","PeriodicalId":416991,"journal":{"name":"Symposium on Antenna Technology and Applied Electromagnetics [ANTEM 2000]","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A wideband model for high density ball-grid array packages for very high speed digital circuits\",\"authors\":\"B. Yassini, S. Safavi-Naeini, T. Manku\",\"doi\":\"10.1109/ANTEM.2000.7851748\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an efficient method for modeling of interconnecting circuit in Super Ball Grid Array (SBGA) packages. The model is based on physical segmentation and electromagnetic (EM) analysis of each segment. An equivalent circuit model based on EM analysis is developed for each segment and connecting individual segment models completes the final model. For verification and calibration the scattering parameters of the resulting model is first compared with EM analysis of important substructure and also with experimental data from a test package. Initial results show good agreement with measurement up to 15GHz‥\",\"PeriodicalId\":416991,\"journal\":{\"name\":\"Symposium on Antenna Technology and Applied Electromagnetics [ANTEM 2000]\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Symposium on Antenna Technology and Applied Electromagnetics [ANTEM 2000]\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ANTEM.2000.7851748\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Symposium on Antenna Technology and Applied Electromagnetics [ANTEM 2000]","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ANTEM.2000.7851748","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A wideband model for high density ball-grid array packages for very high speed digital circuits
This paper presents an efficient method for modeling of interconnecting circuit in Super Ball Grid Array (SBGA) packages. The model is based on physical segmentation and electromagnetic (EM) analysis of each segment. An equivalent circuit model based on EM analysis is developed for each segment and connecting individual segment models completes the final model. For verification and calibration the scattering parameters of the resulting model is first compared with EM analysis of important substructure and also with experimental data from a test package. Initial results show good agreement with measurement up to 15GHz‥
![Symposium on Antenna Technology and Applied Electromagnetics [ANTEM 2000]](/Content/css/sci/img/zetp.jpg)
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
