O. Spahn, C. Sullivan, J. Burkhart, C. Tigges, E. Garcia
{"title":"基于砷化镓的微机电波导开关","authors":"O. Spahn, C. Sullivan, J. Burkhart, C. Tigges, E. Garcia","doi":"10.1109/OMEMS.2000.879617","DOIUrl":null,"url":null,"abstract":"We describe a 1/spl times/2 waveguide switch which is also a cantilever, fabricated in GaAs-based materials. This switch can be cascaded into 1/spl times/N structure. The layout and layer cross section of the waveguide are shown schematically. Actuation is accomplished by electrostatic means, by application of bias between the movable waveguide and static electrodes. This results in 4 /spl mu/m motion of the cantilevered waveguide in the plane of the wafer. The waveguide consists of 4 /spl mu/m thick GaAs/AlGaAs layer, while the release layer is composed of 2 /spl mu/m of Al/sub 0.7/Ga/sub 0.3/As. Metal contacts are deposited on a planar substrate prior to waveguide definition. Then 3 /spl mu/m wide waveguide is defined by RIBE. Photoresist is defined on the areas to be protected against release and sacrificial layer is removed by a HF-based wet etch. After photoresist removal, devices are sublimation dried. Fabrication issues, such as choice of materials, release chemistries and their implications are further discussed. Also, further details of device performance are given.","PeriodicalId":148819,"journal":{"name":"2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"27","resultStr":"{\"title\":\"GaAs-based microelectromechanical waveguide switch\",\"authors\":\"O. Spahn, C. Sullivan, J. Burkhart, C. Tigges, E. Garcia\",\"doi\":\"10.1109/OMEMS.2000.879617\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We describe a 1/spl times/2 waveguide switch which is also a cantilever, fabricated in GaAs-based materials. This switch can be cascaded into 1/spl times/N structure. The layout and layer cross section of the waveguide are shown schematically. Actuation is accomplished by electrostatic means, by application of bias between the movable waveguide and static electrodes. This results in 4 /spl mu/m motion of the cantilevered waveguide in the plane of the wafer. The waveguide consists of 4 /spl mu/m thick GaAs/AlGaAs layer, while the release layer is composed of 2 /spl mu/m of Al/sub 0.7/Ga/sub 0.3/As. Metal contacts are deposited on a planar substrate prior to waveguide definition. Then 3 /spl mu/m wide waveguide is defined by RIBE. Photoresist is defined on the areas to be protected against release and sacrificial layer is removed by a HF-based wet etch. After photoresist removal, devices are sublimation dried. Fabrication issues, such as choice of materials, release chemistries and their implications are further discussed. Also, further details of device performance are given.\",\"PeriodicalId\":148819,\"journal\":{\"name\":\"2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-08-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"27\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/OMEMS.2000.879617\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMEMS.2000.879617","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We describe a 1/spl times/2 waveguide switch which is also a cantilever, fabricated in GaAs-based materials. This switch can be cascaded into 1/spl times/N structure. The layout and layer cross section of the waveguide are shown schematically. Actuation is accomplished by electrostatic means, by application of bias between the movable waveguide and static electrodes. This results in 4 /spl mu/m motion of the cantilevered waveguide in the plane of the wafer. The waveguide consists of 4 /spl mu/m thick GaAs/AlGaAs layer, while the release layer is composed of 2 /spl mu/m of Al/sub 0.7/Ga/sub 0.3/As. Metal contacts are deposited on a planar substrate prior to waveguide definition. Then 3 /spl mu/m wide waveguide is defined by RIBE. Photoresist is defined on the areas to be protected against release and sacrificial layer is removed by a HF-based wet etch. After photoresist removal, devices are sublimation dried. Fabrication issues, such as choice of materials, release chemistries and their implications are further discussed. Also, further details of device performance are given.