富硅氮化硅发光器件的电致发光

Dongsheng Li, Jian-Wei Huang, Deren Yang
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引用次数: 3

摘要

采用等离子体增强化学气相沉积(PECVD)技术,在不同NH3/SiH4气体流量比下制备了不同过量Si浓度的非化学计量氮化硅薄膜。在室温下观察到电致发光现象。结果表明,随Si浓度的增加,光谱峰始终保持在600 nm处。发现在高电场下,电子通过Fowler-Nordheim隧穿和陷阱辅助隧穿注入SRSN薄膜,而在低电场下,电子通过Poole-Frenkel传导注入。所观察到的EL可归因于注入载流子在复合前由于其较长的复合寿命而松弛到较低的缺陷态。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electroluminescence of silicon-rich silicon nitride light-emitting devices
Non-stoichiometric silicon nitride films with different excess Si concentrations were deposited by plasma-enhanced chemical vapor deposition (PECVD) under different NH3/SiH4 gas flow ratios. Room-temperature electroluminescence (EL) was observed from the films. And the peak of EL spectra remains at 600 nm, irrespective of the increase of the Si concentrations. It was found that at high electric fields the electrons were injected into the SRSN film via Fowler-Nordheim tunneling and trap assisted tunneling, while at low electric fields the electrons were injected via Poole-Frenkel conduction. The observed EL can be attributed to the relaxation of injected carriers down the lower defect states before recombination due to their longer recombination lifetime.
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