通过促进发射极扩散过程优化SiGe HBT/BiCMOS垂直轮廓

M. Miura, H. Shimamoto, R. Hayami, A. Kodama, T. Tominari, T. Hashimoto, K. Washio
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引用次数: 1

摘要

提出了一种利用高温退火技术促进发射极扩散(PED)工艺制备高性能SiGe HBTs的新思路。当退火温度从885/spl℃提高到1000/spl℃时,截止频率和最大振荡频率均超过200 GHz。这种PED工艺概念是基于这样一个事实,即增加的磷扩散可以弥补增加的硼扩散和减少的碱厚度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of vertical profiles of SiGe HBT/BiCMOS by promoting emitter diffusion process
A new concept, promoting emitter diffusion (PED) process, by using high-temperature annealing, is proposed for fabricating high-performance SiGe HBTs. Both the cut-off frequency and maximum oscillation frequency exceeded 200 GHz when the annealing temperature was increased from 885/spl deg/C to 1000/spl deg/C. This PED process concept is based on the fact that the increased phosphorus diffusion can more than compensate for increased boron diffusion and decreased base thickness.
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