{"title":"陶瓷芯片载体的回流焊连接及可靠性测试","authors":"H. Charles, B. Romenesko","doi":"10.1109/IRPS.1981.362980","DOIUrl":null,"url":null,"abstract":"The results of an extensive program for the solder reflow attachment and reliability testiny of ceramic chip carriers for use in space satellites, implantable biomedical electronics, and underwater instrumentation are discussed in detail. The program was divided in three major parts; 1) the packaging of integrated circuit chips in ceramic carriers; 2) the selection and qualification of solders, reflow methods and cleaning processes; and 3) the validation of the chip carrier-substrate system for high reliability applications. Military Standard environmental testing of ceramic chip carriers alone and carriers attached to thin film and thick film (multilayer) ceramic substrates, glass, sapphire, and various printed wire circuit boards has been conducted. Test results are presented for various carrier-substrate-solder combinations along with discussions of associated failure modes and fabrication problem areas.","PeriodicalId":376954,"journal":{"name":"19th International Reliability Physics Symposium","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1981-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"The Reflow Attachment and Reliability Testing of Ceramic Chip Carriers\",\"authors\":\"H. Charles, B. Romenesko\",\"doi\":\"10.1109/IRPS.1981.362980\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The results of an extensive program for the solder reflow attachment and reliability testiny of ceramic chip carriers for use in space satellites, implantable biomedical electronics, and underwater instrumentation are discussed in detail. The program was divided in three major parts; 1) the packaging of integrated circuit chips in ceramic carriers; 2) the selection and qualification of solders, reflow methods and cleaning processes; and 3) the validation of the chip carrier-substrate system for high reliability applications. Military Standard environmental testing of ceramic chip carriers alone and carriers attached to thin film and thick film (multilayer) ceramic substrates, glass, sapphire, and various printed wire circuit boards has been conducted. Test results are presented for various carrier-substrate-solder combinations along with discussions of associated failure modes and fabrication problem areas.\",\"PeriodicalId\":376954,\"journal\":{\"name\":\"19th International Reliability Physics Symposium\",\"volume\":\"81 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1981-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1981.362980\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1981.362980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Reflow Attachment and Reliability Testing of Ceramic Chip Carriers
The results of an extensive program for the solder reflow attachment and reliability testiny of ceramic chip carriers for use in space satellites, implantable biomedical electronics, and underwater instrumentation are discussed in detail. The program was divided in three major parts; 1) the packaging of integrated circuit chips in ceramic carriers; 2) the selection and qualification of solders, reflow methods and cleaning processes; and 3) the validation of the chip carrier-substrate system for high reliability applications. Military Standard environmental testing of ceramic chip carriers alone and carriers attached to thin film and thick film (multilayer) ceramic substrates, glass, sapphire, and various printed wire circuit boards has been conducted. Test results are presented for various carrier-substrate-solder combinations along with discussions of associated failure modes and fabrication problem areas.
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