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引用次数: 7
摘要
本文讨论了用于GaAs pHEMT MMIC放大器的典型电路元件的ESD特性数据。在微波和毫米波频率,基本的电路性能考虑驱动设计决策。基本电路元件的人体模型(HBM)数据可以为布局和拓扑权衡提供指导,以提高ESD性能。关键电路元件包括a)紧密间隔的导体,b)场效应管和c)电容器。结构细节和间距影响无源导体的ESD性能。总栅极宽度是影响FET性能的关键因素。面积和介电厚度是电容器的关键。片上二极管网络可以为栅极偏压端子提供实用的保护,很容易超过2000 V HBM。
In this paper, we discuss ESD characterization data on typical circuit elements used in GaAs pHEMT MMIC amplifiers. At microwave and mm-wave frequencies, basic circuit performance considerations drive design decisions. Human body model (HBM) data for basic circuit elements can provide guidance for layout and topology trade-offs to improve ESD performance. Critical circuit elements include a) closely spaced conductors, b) FETs, and c) capacitors. Construction details and spacing affect ESD performance of passive conductors. Total FET gate width is the critical factor for FETs. Area and dielectric thickness are critical for capacitors. On-chip diode networks can provide practical protection for gate bias terminals, easily exceeding 2000 V HBM.