一种多功能的拾取和放置工具，用于超精密放置-在先进的MCM-D技术中应用

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626874

P. Guide, O. Bornholdt, G. Neumann

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引用次数: 1

摘要

用于高性能应用的多芯片模块大多是在MCM-D技术中实现的，并且必须满足许多不同的要求。因此，新的MCM-D技术仍在开发中。提出了一种基于芯片优先技术的新开发的MCM-D方法，该方法适用于高频系统和最高互连密度。这一发展包括高精度拾取和放置工具的设置，允许放置芯片的精度优于5 /spl mu/m。详细介绍了该工具的设置和操作。

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A versatile pick and place tool for ultraprecise placement-demonstrated by the application in an advanced MCM-D technology

Multichip modules for high performance applications are mostly realized in the MCM-D technology and have to satisfy a number of different requirements. Therefore new MCM-D techniques are still under development. A newly developed MCM-D approach based on chip-first technology is presented that is addressed to high-frequency systems as well as to highest interconnect densities. This development includes the set-up of a high precision pick and place tool, that allows the placing of chips with an accuracy of better than 5 /spl mu/m. The set-up and the operation of this tool are described in detail.

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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