具有离散和热增强FCA/COF的双面柔性载流子

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346857

Cynthia S. Milkovich, Michael A. Gaynes, J. S. Perkins

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引用次数: 3

摘要

本文描述了一种电子组件，它使用SMT组件、线键合芯片以及附着在柔性载体上的区域阵列芯片。在封装之前，线键芯片是可修复的。散热器用导热粘合剂附着在倒装芯片和线键芯片上。由系统设计施加的体积限制可以通过在柔性载体的两侧填充元件来满足。这种电子组装设计可以节省潜在的成本，提高可靠性。一个带有芯片的单一柔性载波可以取代多个印刷电路卡和两级互连。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Double sided flexible carrier with discretes and thermally enhanced FCA/COF

This paper describes an electronic assembly that uses SMT components, wire bonded chips as well as area array chips attached to a flexible carrier. The wire bond chip is reworkable until encapsulation. Heat spreaders are attached to flip chips and wire bond chips with thermally conductive adhesives. Volume constraints imposed by a system design can he satisfied by populating both sides of a flexible carrier with components. Potential cost savings and reliability gains are possible with this electronic assembly design. A single flexible carrier with chips can replace multiple printed circuit cards and two levels of interconnection.<>

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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