磁隧道结器件的模块化自旋电路模型

Kerem Y Çamsarı, S. Ganguly, D. Datta
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引用次数: 3

摘要

我们引入了一个模块化的、基于物理的自旋电路SPICE模型,在统一的电路框架中分析传统(电荷电压驱动)和下一代(自旋电压驱动)磁隧道结(MTJ)。提出的模型有3个重要的新颖之处:(1)通过求解输运方程和磁化动力学,定量匹配电荷驱动(c-MTJ)[1,2]和自旋驱动MTJ (s-MTJ)器件[3]的代表性实验,将实验直接与电路联系起来;(2)通过针对实验和理论[4]的基准电路模块,涵盖了广泛的输运和磁体现象,包括界面(巨自旋霍尔效应导致的SMR)的详细自旋传递-扭矩(STT)物理,[5],磁体中的热噪声;磁体之间的磁相互作用,以及与电压相关的自旋转矩和MTJ器件的TMR。(3)通过捕获非理想特性,包括GSHE-FM界面的自旋吸收效率、TMR的高偏置特性和mtj的STT,将材料参数桥接到电路指标,提供能量延迟积[6]等电路指标。我们框架的模块化允许“即插即用”方法来添加或减去来自不同基础理论(自旋扩散,量子输运,通过Landau-Lifshitz-Gilbert (LLG)方程的磁化动力学)的不同现象,以实现MTJ器件建模所需的复杂性水平。由于这些原因,我们相信我们的模型在灵活性,可扩展性,与材料参数的紧密联系以及捕获的物理深度方面与其他模型相比脱颖而出,是STT-MRAM行业的最佳候选TCAD模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A modular spin-circuit model for magnetic tunnel junction devices
We introduce a modular, physics-based, spin-circuit SPICE model to analyze conventional (charge-voltage driven) and next-generation (spin-voltage driven) Magnetic Tunnel Junctions (MTJ) in a unified circuit framework. Proposed model has 3 important novelties: (1) Quantitatively matches representative experiments for charge-driven (c-MTJ) [1,2] and spin-driven MTJ (s-MTJ) devices [3], by solving transport equations and magnetization dynamics, linking experiments directly to circuits, (2) through benchmarked circuit modules against experiments and theory [4], covers a wide range of transport and magnet phenomena, including detailed spin-transfer-torque (STT) physics at interfaces (SMR due to Giant Spin Hall Effect) [5], thermal noise in magnets, magnetic interactions between magnets as well as voltage-dependent spin-torque and TMR of MTJ devices. (3) provides circuit metrics such as Energy-Delay product [6] by capturing non-idealities including spin-absorption efficiency at the GSHE-FM interface, high-bias features of TMR and STT of the MTJs, bridging material parameters to circuit metrics. The modularity of our framework allows a "plug-and-play" approach to add or subtract different phenomena that are derived from a diverse set of underlying theories (spin-diffusion, quantum transport, magnetization dynamics through Landau-Lifshitz-Gilbert (LLG) equation to achieve the desired level of complexity for modeling MTJ devices. Due to these reasons, we believe our model stands out compared to others in terms of flexibility, extensibility, close connection to material parameters and depth of physics captured and is the best candidate TCAD model for the STT-MRAM industry.
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