改进外风处理装置在半导体晶圆厂的节能效果

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI:10.1109/ISSM.2000.993671

H. Suzuki, H. Hanaoka, Y. Ohkubo, Y. Yamazaki, Y. Shirai, T. Ohmi

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引用次数: 10

摘要

我们展示了节能的方法。半导体晶圆厂的能源消耗分为两类，制造系统和空调。空调的能量进一步分为新风进气口、再循环(洁净室)空调和制造系统的冷却系统。新鲜空气中的水分在空气处理机组(AHU)的热交换片上冷凝。这种冷凝减少了热交换，增加了进气阻力，去除它可以提高性能。将其去除后，换热系数提高了24%。利用该结果，制冷机节能5%。若将该结果应用于所有暖通空调系统，则节能3%。

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Energy saving in semiconductor fabs by out-air handling unit performance improvement

We shows methods of energy saving. The energy consumed in semiconductor fabs is classified into two categories, the manufacturing system and the air conditioning. The energy for the air conditioning is further classified into fresh air intake, recirculation (clean room) air conditioning and cooling system of the manufacturing system. The moisture in the fresh air is condensed on a heat exchange-fin of the air-handling unit (AHU). This condensation decreases thermal exchange and increases intake-air resistance and removal of it improves the performance. So we removed it, and 24% improvement of coefficient of heat exchange is achieved. Using this result, a 5% energy saving of the refrigerator is obtained. If the result is applied to all of the heating, ventilation, and air conditioning (HVAC) system, 3% energy saving is obtained.

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Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)

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