实时真空检漏技术计算干汽提真空检漏参数:EO:设备优化

2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Pub Date : 2022-05-02 DOI:10.1109/asmc54647.2022.9792477

J. Jeong, Taekyung Ha, Hyojeong Ji, S. J. Yoon

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引用次数: 0

摘要

在半导体制造中，晶圆加工过程中发生的真空泄漏会降低生产率。通常，设备会停止以检测真空泄漏。然而，这对生产力产生了不利影响。提出了一种实时真空泄漏检测技术。通过对干带钢工艺参数的插值，实现了真空泄漏的实时识别。

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Real-time vacuum leak detection technology to calculate vacuum leak parameters for dry stripping : EO: Equipment Optimization

In semiconductor manufacturing, vacuum leakage occurring during wafer processing decreases productivity. Conventionally, the equipment is stopped to detect the vacuum leaks. However, this adversely affects productivity. We presents a real-time vacuum leak detection technique. We successfully identified vacuum leakage in real time by interpolating from the dry strip process parameters.

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2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

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