硅片抛光雾的研究

2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) Pub Date : 2001-10-22 DOI:10.1109/ICSICT.2001.981477

Weiguo Di, Yu-ling Liu, B. Tan, Weiwei Li, Ming Yang

{"title":"硅片抛光雾的研究","authors":"Weiguo Di, Yu-ling Liu, B. Tan, Weiwei Li, Ming Yang","doi":"10.1109/ICSICT.2001.981477","DOIUrl":null,"url":null,"abstract":"In this paper, the mechanism of producing polishing fog is studied. The factors that influence polishing fog are analysis. Optimizing polishing technology on the basis of experiments can control the polishing fog.","PeriodicalId":349087,"journal":{"name":"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The research of silicon wafer's polishing fog\",\"authors\":\"Weiguo Di, Yu-ling Liu, B. Tan, Weiwei Li, Ming Yang\",\"doi\":\"10.1109/ICSICT.2001.981477\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the mechanism of producing polishing fog is studied. The factors that influence polishing fog are analysis. Optimizing polishing technology on the basis of experiments can control the polishing fog.\",\"PeriodicalId\":349087,\"journal\":{\"name\":\"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT.2001.981477\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.2001.981477","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文对抛光雾的产生机理进行了研究。分析了影响抛光雾的因素。在实验的基础上优化抛光工艺，可以有效地控制抛光雾。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The research of silicon wafer's polishing fog

In this paper, the mechanism of producing polishing fog is studied. The factors that influence polishing fog are analysis. Optimizing polishing technology on the basis of experiments can control the polishing fog.

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2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)

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