采用液晶聚合物(LCP)材料的用于多层3d系统封装(SOP)技术的微波/毫米器件

The 2012 International Workshop on Microwave and Millimeter Wave Circuits and System Technology Pub Date : 2012-04-19 DOI:10.1109/MMWCST.2012.6238152

E. O. Boadu, M. T. Elsir, M. Hossin, A. Amoah

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引用次数: 0

摘要

介绍了一种利用液晶聚合物(LCP)材料的新型微波/毫米器件，该器件具有良好的电学和力学性能。本文设计并仿真了一种适用于5GHz高性能WLAN应用的全系统单包(SOP)天线模块。所提出的天线印刷在从刚性多层有机基板突出的柔性LCP层上。在设计中还考虑了保护模块电路免受天线近场干扰的金属外壳的屏蔽作用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Microwave/millimeter devices for multilayer 3D-System-On-Packaging (SOP) technology using Liquid Crystal Polymer (LCP) material

We describe a new class of microwave/millimeter device utilizing Liquid Crystal Polymer (LCP) material which has showed a combination of good electrical and mechanical properties. This paper presents the design and simulation of a fully System-On-Package (SOP) antenna module that will be suitable for 5GHz WLAN application with high performance. The proposed antenna is printed on a flexible LCP layer, protruding from a rigid multilayer organic substrate. The shielding effect of the metal case which protects the module circuitry from the near fields of the antenna was also taken care of during the design.

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The 2012 International Workshop on Microwave and Millimeter Wave Circuits and System Technology

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