用于制定汽车部件包装和处理的静电放电(ESD)敏感性分类的方法学

K. K. Katrak
{"title":"用于制定汽车部件包装和处理的静电放电(ESD)敏感性分类的方法学","authors":"K. K. Katrak","doi":"10.1109/ISEMC.1994.385651","DOIUrl":null,"url":null,"abstract":"Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<<ETX>>","PeriodicalId":154914,"journal":{"name":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","volume":"26 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Methodology used for the development of an electrostatic discharge (ESD) sensitivity classification for packaging and handling of automotive components\",\"authors\":\"K. K. Katrak\",\"doi\":\"10.1109/ISEMC.1994.385651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<<ETX>>\",\"PeriodicalId\":154914,\"journal\":{\"name\":\"Proceedings of IEEE Symposium on Electromagnetic Compatibility\",\"volume\":\"26 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-08-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.1994.385651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1994.385651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

静电放电(ESD)是一种日益严重的电气过应力损伤威胁,无论是在分立电子器件还是电子元件的集成电路中。在通电状态下评估电子元件的测试程序已经可用。也有评估处理和包装组件的ESD灵敏度的测试程序,但实际结果表明它存在缺陷。因此,开发一个与真实世界的结果相关联的测试程序是非常必要的。本文描述了一种测试方法的发展,该方法可以评估组件的ESD灵敏度,并模拟现实的搬运和包装条件
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Methodology used for the development of an electrostatic discharge (ESD) sensitivity classification for packaging and handling of automotive components
Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信