{"title":"用于制定汽车部件包装和处理的静电放电(ESD)敏感性分类的方法学","authors":"K. K. Katrak","doi":"10.1109/ISEMC.1994.385651","DOIUrl":null,"url":null,"abstract":"Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<<ETX>>","PeriodicalId":154914,"journal":{"name":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","volume":"26 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Methodology used for the development of an electrostatic discharge (ESD) sensitivity classification for packaging and handling of automotive components\",\"authors\":\"K. K. Katrak\",\"doi\":\"10.1109/ISEMC.1994.385651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<<ETX>>\",\"PeriodicalId\":154914,\"journal\":{\"name\":\"Proceedings of IEEE Symposium on Electromagnetic Compatibility\",\"volume\":\"26 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-08-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.1994.385651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1994.385651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Methodology used for the development of an electrostatic discharge (ESD) sensitivity classification for packaging and handling of automotive components
Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<>