{"title":"微波集成电路模块基本结构及元件设计问题","authors":"S.A. Babunko, O. Orlov","doi":"10.1109/CRMICO.2003.158945","DOIUrl":null,"url":null,"abstract":"The issues of developing multipurpose basic structures and components for hybrid microwave IC modules are considered. Physics-related, technical and economic problems and limitations are discussed. Examples of IC component design are listed, outlook for this technology is reviewed.","PeriodicalId":131192,"journal":{"name":"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.","volume":"2019 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Issues of designing basic structures and components of microwave IC modules\",\"authors\":\"S.A. Babunko, O. Orlov\",\"doi\":\"10.1109/CRMICO.2003.158945\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The issues of developing multipurpose basic structures and components for hybrid microwave IC modules are considered. Physics-related, technical and economic problems and limitations are discussed. Examples of IC component design are listed, outlook for this technology is reviewed.\",\"PeriodicalId\":131192,\"journal\":{\"name\":\"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.\",\"volume\":\"2019 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CRMICO.2003.158945\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CRMICO.2003.158945","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Issues of designing basic structures and components of microwave IC modules
The issues of developing multipurpose basic structures and components for hybrid microwave IC modules are considered. Physics-related, technical and economic problems and limitations are discussed. Examples of IC component design are listed, outlook for this technology is reviewed.