采用BeO陶瓷的先进微电子封装

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI:10.1109/ISAPM.1998.664472

J. L. Sepulveda

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引用次数: 5

摘要

铍陶瓷在过去的四十年中已经成功地用于生产可靠的封装解决方案，用于广泛的商业微电子封装应用。陶瓷性能在数百万电路的生产过程中得到了很好的定义和一致的控制，以确保高性能运行和产品可靠性。

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Advanced microelectronic packaging using BeO ceramics

Beryllia ceramics have been successfully used during the last forty years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well defined and consistently controlled throughout production of many millions of circuits to insure high performance operation and product reliability.

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Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)

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