聚酰亚胺微机械结构的RIE

ASDAM 2000. Conference Proceedings. Third International EuroConference on Advanced Semiconductor Devices and Microsystems (Cat. No.00EX386) Pub Date : 2000-10-16 DOI:10.1109/ASDAM.2000.889547

L. Matay, I. Kostic, P. Hrkut, R. Andok

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引用次数: 3

摘要

聚酰亚胺是一种市售材料，广泛应用于微电子的各个方面。在这项工作中，我们展示了聚酰亚胺作为一种适合形成微机械结构的材料，并通过反应离子蚀刻对其进行改性。

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RIE of the polyimide micromechanical structures

Polyimides are commercially available materials which are widely used in various aspects of microelectronics. In this work, we show the use of a polyimide as a material suitable for the formation of micromechanical structures and its modification by reactive ion etching.

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ASDAM 2000. Conference Proceedings. Third International EuroConference on Advanced Semiconductor Devices and Microsystems (Cat. No.00EX386)

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