{"title":"通过规划3D集成电路实现层间性能最大化","authors":"Jun Lu, Song Chen, T. Yoshimura","doi":"10.1109/ICASIC.2007.4415824","DOIUrl":null,"url":null,"abstract":"As the development of semiconductor industry, 3D IC technology is introduced for its advantages in alleviating the interconnect problem coming with decreasing feature size and increasing integrated density. In 3D IC fabrication, one of the key challenges is the vertical connections between different device layers, which can be implemented by interlayer vias. In this paper, we proposed a performance-maximized interlayer via planning method for 3D ICs (multiple device layers), which can be used in the post-floorplanning stage.","PeriodicalId":120984,"journal":{"name":"2007 7th International Conference on ASIC","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Performance maximized interlayer via planning for 3D ICs\",\"authors\":\"Jun Lu, Song Chen, T. Yoshimura\",\"doi\":\"10.1109/ICASIC.2007.4415824\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the development of semiconductor industry, 3D IC technology is introduced for its advantages in alleviating the interconnect problem coming with decreasing feature size and increasing integrated density. In 3D IC fabrication, one of the key challenges is the vertical connections between different device layers, which can be implemented by interlayer vias. In this paper, we proposed a performance-maximized interlayer via planning method for 3D ICs (multiple device layers), which can be used in the post-floorplanning stage.\",\"PeriodicalId\":120984,\"journal\":{\"name\":\"2007 7th International Conference on ASIC\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 7th International Conference on ASIC\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICASIC.2007.4415824\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 7th International Conference on ASIC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICASIC.2007.4415824","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance maximized interlayer via planning for 3D ICs
As the development of semiconductor industry, 3D IC technology is introduced for its advantages in alleviating the interconnect problem coming with decreasing feature size and increasing integrated density. In 3D IC fabrication, one of the key challenges is the vertical connections between different device layers, which can be implemented by interlayer vias. In this paper, we proposed a performance-maximized interlayer via planning method for 3D ICs (multiple device layers), which can be used in the post-floorplanning stage.
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