半导体材料的激光诱导调制反射分析

A. Rosencwaig
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引用次数: 0

摘要

近年来,热波物理已成功地应用于半导体材料和微电子器件的研究。之前,我们描述了如何用热波成像来检测这些材料和器件这种成像是在扫描电子显微镜下进行的,采用热弹性技术进行热波检测。虽然这种技术是一种对热波非常敏感的检测方法,但它对集成电路过程控制和检查的适用性有限,因为它需要接触换能器,因此可能会污染。此外,结果往往强烈依赖于难以控制的声学变量,如样品几何形状和样品/检测器耦合。为了克服这些问题,我们开发了一种非接触式热波技术,可以在微米级分辨率所需的高调制频率下使用
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Laser-Induced Modulated Reflectance in Semiconductor Materials Analysis
During the past few years, thermal wave physics has been successfully applied to studies of semiconductor materials and microelectronic devices. Previously, we described how these materials and devices might be examined with thermal wave imaging.1 This imaging is performed in a scanning electron microscope with a thermoelastic technique for thermal wave detection. Although this technique is a very sensitive detection method for thermal waves,2 it has limited applicability for integrated circuit process control and inspection because it requires contact to a transducer and thus is potentially contaminating. Furthermore the results are often strongly dependent on difficult to control acoustic variables such as sample geometry and sample/detector coupling. To overcome these problems we have developed a noncontact thermal wave technique that can be used at the high modulation frequencies required for micron-scale resolution.3–5
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