数字集成电路电应力的表征与建模，功率完整性与传导发射

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI:10.1109/EMCCOMPO.2013.6735199

A. Boyer, S. Bendhia

{"title":"数字集成电路电应力的表征与建模，功率完整性与传导发射","authors":"A. Boyer, S. Bendhia","doi":"10.1109/EMCCOMPO.2013.6735199","DOIUrl":null,"url":null,"abstract":"Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity and the conducted emission of digital integrated circuits, clarifying the origin of electromagnetic emission evolution and proposing a methodology to predict this evolution. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip and conducted emission measurements are combined with electric stress to characterize the influence of aging. Simulations based on ICEM modeling modified by an empirical coefficient to model the evolution of the emission induced by device aging is proposed and tested.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission\",\"authors\":\"A. Boyer, S. Bendhia\",\"doi\":\"10.1109/EMCCOMPO.2013.6735199\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity and the conducted emission of digital integrated circuits, clarifying the origin of electromagnetic emission evolution and proposing a methodology to predict this evolution. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip and conducted emission measurements are combined with electric stress to characterize the influence of aging. Simulations based on ICEM modeling modified by an empirical coefficient to model the evolution of the emission induced by device aging is proposed and tested.\",\"PeriodicalId\":302757,\"journal\":{\"name\":\"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCCOMPO.2013.6735199\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCCOMPO.2013.6735199","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

近年来的研究表明，集成电路老化对电磁发射有显著的影响。本文旨在评估老化对数字集成电路电源完整性和传导发射的影响，阐明电磁发射演变的起源，并提出一种预测电磁发射演变的方法。在CMOS 90nm技术测试芯片上对电源电压反弹的片上测量和传导发射测量结合电应力来表征老化的影响。提出并验证了基于经验系数修正的ICEM模型对器件老化致发射演化的模拟。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission

Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity and the conducted emission of digital integrated circuits, clarifying the origin of electromagnetic emission evolution and proposing a methodology to predict this evolution. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip and conducted emission measurements are combined with electric stress to characterize the influence of aging. Simulations based on ICEM modeling modified by an empirical coefficient to model the evolution of the emission induced by device aging is proposed and tested.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

自引率

0.00%

发文量