考虑热分布的配电网阻抗分析

Keeyoung Son, Daehwan Lho, Keunwoo Kim, Seonguk Choi, Haeyeon Kim, Hyunwook Park, Boogyo Sim, Hyunwoo Kim, Taein Shin, Joungho Kim
{"title":"考虑热分布的配电网阻抗分析","authors":"Keeyoung Son, Daehwan Lho, Keunwoo Kim, Seonguk Choi, Haeyeon Kim, Hyunwook Park, Boogyo Sim, Hyunwoo Kim, Taein Shin, Joungho Kim","doi":"10.1109/EDAPS56906.2022.9995613","DOIUrl":null,"url":null,"abstract":"In this paper, we analyzed a power distribution network (PDN) impedance considering thermal distribution. Due to the development of integrated circuits (ICs) towards high density and high performance, the supply voltage has been reduced while power density has been increased. Shrunk supply voltage causes a low voltage margin and high temperature caused by the high power density varies the circuit parameters of the PDN. Thus, considering the operating temperature effects for a robust PDN design is essential. However, the previous power integrity analysis is not focused on temperature effects on PDN. Hence, impedance analysis of PDN considering thermal distribution is essential. Therefore, this research analyzed thermal distribution effects on the self-impedance of PDN. By using a W-element model, we analyzed thermal distribution effects on PDN self-impedance by circuit simulation. As a result, the difference in self-impedances is observed between the PDNs with other thermal distributions in spite of current loop path and mean temperature; The capacitance has same value as the capacitance considering mean temperature of thermal distribution; The value of the resistance closes to the resistance considering the temperature at the probing point, not the mean temperature.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Power Distribution Network Impedance Analysis considering Thermal Distribution\",\"authors\":\"Keeyoung Son, Daehwan Lho, Keunwoo Kim, Seonguk Choi, Haeyeon Kim, Hyunwook Park, Boogyo Sim, Hyunwoo Kim, Taein Shin, Joungho Kim\",\"doi\":\"10.1109/EDAPS56906.2022.9995613\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we analyzed a power distribution network (PDN) impedance considering thermal distribution. Due to the development of integrated circuits (ICs) towards high density and high performance, the supply voltage has been reduced while power density has been increased. Shrunk supply voltage causes a low voltage margin and high temperature caused by the high power density varies the circuit parameters of the PDN. Thus, considering the operating temperature effects for a robust PDN design is essential. However, the previous power integrity analysis is not focused on temperature effects on PDN. Hence, impedance analysis of PDN considering thermal distribution is essential. Therefore, this research analyzed thermal distribution effects on the self-impedance of PDN. By using a W-element model, we analyzed thermal distribution effects on PDN self-impedance by circuit simulation. As a result, the difference in self-impedances is observed between the PDNs with other thermal distributions in spite of current loop path and mean temperature; The capacitance has same value as the capacitance considering mean temperature of thermal distribution; The value of the resistance closes to the resistance considering the temperature at the probing point, not the mean temperature.\",\"PeriodicalId\":401014,\"journal\":{\"name\":\"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS56906.2022.9995613\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS56906.2022.9995613","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文对考虑热分布的配电网络阻抗进行了分析。随着集成电路向高密度、高性能方向发展,电源电压不断降低,功率密度不断提高。电源电压收缩导致PDN的电压裕度低、温度高,这是由于高功率密度改变PDN的电路参数造成的。因此,考虑工作温度对稳健PDN设计的影响是必不可少的。然而,以往的功率完整性分析并没有关注温度对PDN的影响。因此,考虑热分布的PDN阻抗分析是必要的。因此,本研究分析了热分布对PDN自阻抗的影响。采用w元模型,通过电路仿真分析了热分布对PDN自阻抗的影响。结果表明,无论电流回路路径和平均温度如何,具有其他热分布的pdn之间的自阻抗存在差异;电容值与考虑热分布平均温度的电容值相同;电阻的值接近于考虑探测点温度的电阻,而不是平均温度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power Distribution Network Impedance Analysis considering Thermal Distribution
In this paper, we analyzed a power distribution network (PDN) impedance considering thermal distribution. Due to the development of integrated circuits (ICs) towards high density and high performance, the supply voltage has been reduced while power density has been increased. Shrunk supply voltage causes a low voltage margin and high temperature caused by the high power density varies the circuit parameters of the PDN. Thus, considering the operating temperature effects for a robust PDN design is essential. However, the previous power integrity analysis is not focused on temperature effects on PDN. Hence, impedance analysis of PDN considering thermal distribution is essential. Therefore, this research analyzed thermal distribution effects on the self-impedance of PDN. By using a W-element model, we analyzed thermal distribution effects on PDN self-impedance by circuit simulation. As a result, the difference in self-impedances is observed between the PDNs with other thermal distributions in spite of current loop path and mean temperature; The capacitance has same value as the capacitance considering mean temperature of thermal distribution; The value of the resistance closes to the resistance considering the temperature at the probing point, not the mean temperature.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信