亚波长/sup TM/设计的硅级物理验证

F. Chang, Melissa Kwok, K. Rachlin, R. Pack
{"title":"亚波长/sup TM/设计的硅级物理验证","authors":"F. Chang, Melissa Kwok, K. Rachlin, R. Pack","doi":"10.1109/ICVD.1999.745221","DOIUrl":null,"url":null,"abstract":"In this paper, we show that the use of SubWavelength mask design for improved IC performance and yield presents new challenges for traditional deep submicron ECAD physical verification tools. We demonstrate the need for new approaches and propose two tools for the silicon-level physical verification of SubWavelength designs. Fortunately, these tools work within current physical verification design flows.","PeriodicalId":443373,"journal":{"name":"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Silicon-level physical verification of SubWavelength/sup TM/ designs\",\"authors\":\"F. Chang, Melissa Kwok, K. Rachlin, R. Pack\",\"doi\":\"10.1109/ICVD.1999.745221\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we show that the use of SubWavelength mask design for improved IC performance and yield presents new challenges for traditional deep submicron ECAD physical verification tools. We demonstrate the need for new approaches and propose two tools for the silicon-level physical verification of SubWavelength designs. Fortunately, these tools work within current physical verification design flows.\",\"PeriodicalId\":443373,\"journal\":{\"name\":\"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-01-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICVD.1999.745221\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICVD.1999.745221","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

在本文中,我们表明,使用亚波长掩模设计来提高IC性能和良率,对传统的深亚微米ECAD物理验证工具提出了新的挑战。我们展示了对新方法的需求,并提出了两种用于亚波长设计的硅级物理验证的工具。幸运的是,这些工具可以在当前的物理验证设计流程中工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon-level physical verification of SubWavelength/sup TM/ designs
In this paper, we show that the use of SubWavelength mask design for improved IC performance and yield presents new challenges for traditional deep submicron ECAD physical verification tools. We demonstrate the need for new approaches and propose two tools for the silicon-level physical verification of SubWavelength designs. Fortunately, these tools work within current physical verification design flows.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信