{"title":"三维集成电感DC-DC变换器在高性能电力传输中的潜力","authors":"S. Carlo, W. Yueh, S. Mukhopadhyay","doi":"10.1145/2463209.2488955","DOIUrl":null,"url":null,"abstract":"This paper studies the potential and challenges of integrating an inductor based DC-DC converter based voltage regulator module (VRM) as a separate die with processor for high-performance power delivery network (PD ). The frequency domain analysis of PD considering the converter shows 3D integration of VRM improves PD impedance but the effectiveness depends on the converter design and whether the LC filter is integrated on-board, on-package, or on-die with the die-stack. The methodologies to co-design the converter with PD and packaging scenarios are discussed and implications on PD impedance and power losses are studied to maximally exploit the advantage of 3D stacking.","PeriodicalId":320207,"journal":{"name":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"On the potential of 3D integration of inductive DC-DC converter for high-performance power delivery\",\"authors\":\"S. Carlo, W. Yueh, S. Mukhopadhyay\",\"doi\":\"10.1145/2463209.2488955\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper studies the potential and challenges of integrating an inductor based DC-DC converter based voltage regulator module (VRM) as a separate die with processor for high-performance power delivery network (PD ). The frequency domain analysis of PD considering the converter shows 3D integration of VRM improves PD impedance but the effectiveness depends on the converter design and whether the LC filter is integrated on-board, on-package, or on-die with the die-stack. The methodologies to co-design the converter with PD and packaging scenarios are discussed and implications on PD impedance and power losses are studied to maximally exploit the advantage of 3D stacking.\",\"PeriodicalId\":320207,\"journal\":{\"name\":\"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-05-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/2463209.2488955\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2463209.2488955","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On the potential of 3D integration of inductive DC-DC converter for high-performance power delivery
This paper studies the potential and challenges of integrating an inductor based DC-DC converter based voltage regulator module (VRM) as a separate die with processor for high-performance power delivery network (PD ). The frequency domain analysis of PD considering the converter shows 3D integration of VRM improves PD impedance but the effectiveness depends on the converter design and whether the LC filter is integrated on-board, on-package, or on-die with the die-stack. The methodologies to co-design the converter with PD and packaging scenarios are discussed and implications on PD impedance and power losses are studied to maximally exploit the advantage of 3D stacking.
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