{"title":"铝腐蚀速率决定因素及塑料封装LSI耐湿性快速评定方法","authors":"K. Tsubosaki, Y. Wakashima, N. Nagasima","doi":"10.1109/IRPS.1983.361965","DOIUrl":null,"url":null,"abstract":"New information about the aluminum corrosion of plastic encapsuled LSI was derived from measuring the leakage current on the die surface. Aluminum corrosion at temperature/humidity tests depends upon the water film produced at the interface between the molding resin and die. The moisture resistance of plastic encapsulated LSI can be rapidly evaluated by electrical leakage which can be related to water film formation.","PeriodicalId":334813,"journal":{"name":"21st International Reliability Physics Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1983-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Rate-Determining Factor of Aluminum Corrosion and a Rapid Method of Assessing the Moisture Resistance of Plastic Encapsulated LSI\",\"authors\":\"K. Tsubosaki, Y. Wakashima, N. Nagasima\",\"doi\":\"10.1109/IRPS.1983.361965\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New information about the aluminum corrosion of plastic encapsuled LSI was derived from measuring the leakage current on the die surface. Aluminum corrosion at temperature/humidity tests depends upon the water film produced at the interface between the molding resin and die. The moisture resistance of plastic encapsulated LSI can be rapidly evaluated by electrical leakage which can be related to water film formation.\",\"PeriodicalId\":334813,\"journal\":{\"name\":\"21st International Reliability Physics Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1983-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"21st International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1983.361965\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"21st International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1983.361965","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Rate-Determining Factor of Aluminum Corrosion and a Rapid Method of Assessing the Moisture Resistance of Plastic Encapsulated LSI
New information about the aluminum corrosion of plastic encapsuled LSI was derived from measuring the leakage current on the die surface. Aluminum corrosion at temperature/humidity tests depends upon the water film produced at the interface between the molding resin and die. The moisture resistance of plastic encapsulated LSI can be rapidly evaluated by electrical leakage which can be related to water film formation.
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