使用IC已知负载对封装进行射频建模的方法

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI:10.1109/EPEPS.2011.6100189

M. Ballicchia, M. Farina, A. Morini, T. Rozzi, C. Turchetti, S. Orcioni

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引用次数: 4

摘要

本文提出了一种方法，从一组仅在封装的外部引脚处拾取的校准测量开始，允许确定其代表性矩阵。这样的矩阵既可以用于嵌入式设备的正确测量，也可以通过考虑封装的影响来改进其设计。该技术在一个封装的无源集成电感器上进行了演示。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A methodology for RF modeling of packages using IC known-loads

The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.

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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

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