半导体制造中集群工具分析过程时间模型的自动生成

Robert Kohn, O. Rose
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引用次数: 7

摘要

在本文中,我们提出了一种使用实际数据自动创建集群工具的分析过程时间模型的方法。该模型结合了简单吞吐量模型和离散事件仿真模型的优点。我们考虑了小批量的影响和同时加工的批量相互干扰时产生的减速效应。特别是根据特定的配方组合和开始延迟使用减速因子,充分反映了顺序和并行处理模式。我们还描述了一种自动生成高精度参数化模型的建模方法。本研究展示了从模型中获得的评估结果,这些模型是我们根据过去设备事件收集的真实数据创建和测试的。我们通过三个例子来讨论典型的加工行为。我们得出的结论是,所提出的分析聚类工具模型适用于预测过程时间的准确性和预测覆盖率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Automated generation of analytical process time models for cluster tools in semiconductor manufacturing
In this paper, we present an approach to automatically create an analytical process time model for cluster tools using real-world data. The proposed model combines advantages of simple throughput models and discrete event simulation models. We consider the effect of small lot size and the slow down effect occurring when simultaneously processed lots interfere with each other. Especially the use of Slow Down Factors depending on a certain recipe combination and start delay adequately mirrors sequential and parallel processing mode. We also describe a modeling method that automatically leads to parameterized models with high accuracy. This study presents evaluation results gained from models, which we create from and test against real-world data gathered from past equipment events. We discuss exemplary processing behaviors by means of three examples. We conclude that the proposed analytical cluster tool model is suitable to predict process times with respect to accuracy and prediction coverage.
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