分而治之[SoC设计]

F. Rémond, P. Bougant, T. McCracken, P. Pezzati
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引用次数: 0

摘要

芯片级集成的复杂性阻碍了SoC设计的有效逻辑密度-使得难以构建复杂的芯片,例如高集成度的机顶盒控制器。当团队采用利用可以分别处理逻辑和物理分区的工具的方法时,这种情况可能会发生变化。在物理层,片上系统(SoC)设计方法已经发展到通过提高时序、路由和设计完整性关闭的可预测性来增加密度和缩短实现时间。基于物理分区的方法充分利用了新兴工具和可用的芯片密度。该方法的有效性来自于最近在后端工具中提供的三个元素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Divide and conquer [SoC design]
The complexity of chip-level integration has held back the effective logic density of SoC designs - making it difficult to build complex chips, such as high-integration set-top box controllers. That could change as teams adopt methods taking advantage of tools that can deal with logical and physical partitions separately. At the physical level, system-on-chip (SoC) design methods have evolved to increase density and shorten implementation time by improving predictability on timing, routing and design integrity closure. Methods based on physical partitions have taken full advantage of emerging tools and available chip density. The effectiveness of the approach comes from three elements that have been made available recently in back-end tools.
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