发布求助
文献互助 智能选刊 最新文献

表面微加工微机电执行器的可靠性

2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400) Pub Date : 2000-05-14 DOI:10.1109/ICMEL.2000.840535
Dandle M. Tanner
{"title":"表面微加工微机电执行器的可靠性","authors":"Dandle M. Tanner","doi":"10.1109/ICMEL.2000.840535","DOIUrl":null,"url":null,"abstract":"This paper will review some of the investigations into MicroElectroMechanical systems (MEMS) reliability. It will categorize the major reliability issues of MEMS actuators. Reliability concerns of stiction, mechanical wear, fracture, fatigue, shock, and vibration will be discussed.","PeriodicalId":215956,"journal":{"name":"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"38","resultStr":"{\"title\":\"Reliability of surface micromachined MicroElectroMechanical actuators\",\"authors\":\"Dandle M. Tanner\",\"doi\":\"10.1109/ICMEL.2000.840535\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper will review some of the investigations into MicroElectroMechanical systems (MEMS) reliability. It will categorize the major reliability issues of MEMS actuators. Reliability concerns of stiction, mechanical wear, fracture, fatigue, shock, and vibration will be discussed.\",\"PeriodicalId\":215956,\"journal\":{\"name\":\"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"38\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMEL.2000.840535\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMEL.2000.840535","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 38

摘要

本文将对微机电系统(MEMS)可靠性的一些研究进行综述。它将对MEMS执行器的主要可靠性问题进行分类。将讨论粘滞、机械磨损、断裂、疲劳、冲击和振动的可靠性问题。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
分享
查看原文 本刊更多论文
Reliability of surface micromachined MicroElectroMechanical actuators
This paper will review some of the investigations into MicroElectroMechanical systems (MEMS) reliability. It will categorize the major reliability issues of MEMS actuators. Reliability concerns of stiction, mechanical wear, fracture, fatigue, shock, and vibration will be discussed.
求助全文
通过发布文献求助，成功后即可免费获取论文全文。 去求助
来源期刊
2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)
2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信