基于自旋电子学的内存计算缺陷表征与测试生成

S. Nair, Christopher Münch, M. Tahoori
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引用次数: 12

摘要

自旋转移转矩磁随机存取存储器(STT-MRAM)作为片上存储器中最有前途的新兴存储技术之一,具有高密度、非易失性、可扩展性、高耐用性和CMOS兼容性等优点。此外,它的电阻式存储概念可以用于内存计算(CiM),在内存中可以执行按位逻辑操作,而不需要将数据从内存传输到处理器并返回。但是,这些新的CiM操作会受到缺陷的影响,导致与传统内存故障不同的故障。因此,需要对这些CiM特定的错误进行建模,并且需要派生适当的测试策略,以确保启用CiM的内存具有正确的功能。本文首先在CiM位单元中进行了广泛的缺陷注入,并基于缺陷的影响建立了故障模型。并将CiM特定故障与普通内存故障进行比较。基于该模型,我们推导出一种有效的测试算法,可以完全覆盖CiM相关的故障,而传统的内存测试算法无法发现这些故障。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Defect Characterization and Test Generation for Spintronic-based Compute-In-Memory
Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM), as one of the most promising emerging memory technology for on-chip memory, offers many advantageous features such as high density, non-volatility, scalability, high endurance and CMOS compatibility. Additionally, its resistive storage concept can be utilized for Compute-in-Memory (CiM), where bit-wise logical operations can be performed within the memory without the need for transferring the data from the memory to the processor and back. However, these new CiM operations are impacted by defects, resulting in faults which are different from the conventional memory faults. Hence, these CiM specific faults need to be modeled and appropriate test strategies need to be derived to ensure correct functionality of the CiM enabled memories. In this paper, we first perform extensive defect injection in the CiM bit-cell and build fault models based on the impact of the defects. We also compare CiM specific faults to normal memory faults based on this technology. From this model, we derive an efficient test algorithm to fully cover CiM related faults, which cannot be found with conventional memory test algorithms.
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