Stress Analysis On Hybrid Multilayer Substrate Composed Of Polyimide And Ceramics

The mechanical characteristics of thin film multilayer circuits ire investigated by stress analysis based on experiments. The warping and separation of the film from the substrate is observed experimentally by repeatedly depositing polyimide films on the substrate, revealing the relationship between film thickness and stress in the film. To simulate the stress, we estimated the mechanical properties from the warpings of the films on the substrates. substrate is a quadratic function of the film thickness deposited on it, just as for a bi-metal. The maximum thickness of thin film that will not peel off from the substrate can be estimated from this relationship. The warping of the