基于测试电路的芯片间和芯片内mosfet性能变化提取模拟设计可靠性

S. Matsumoto, H. Mattausch, S. Ooshiro, Y. Tatsumi, M. Miura-Mattausch, S. Kumashiro, Terufumi Yamaguchi, K. Yamashita, N. Nakayama
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引用次数: 10

摘要

我们提出了一种有效的、基于测试电路的方法,不仅可以确定cmos器件参数的变化,还可以同时区分芯片内和芯片间的变化。采用带反馈耦合的差分放大级作为测试电路,采用漂移扩散MOSFET模型HiSIM进行电路仿真,验证了该方法的有效性。结果表明,当仅使用n- mosfet或p- mosfet构建时,所提出的测试电路可以直接分离栅极长度和沟道掺杂变化以及它们在片间和片内的幅度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Test-circuit-based extraction of inter- and intra-chip MOSFET-performance variations for analog-design reliability
We propose an efficient, test-circuit-based method to determine not only CMOS-device-parameter variations but to simultaneously separate intra-chip from inter-chip variations. The method is demonstrated by using a differential-amplifier stage with feedback coupling as the test-circuit and the drift-diffusion MOSFET model HiSIM for the circuit simulation. The result shows that the proposed test circuit, when constructed only with n-MOSFETs or p-MOSFETs, enables one to separate gate length and channel doping variations as well as their inter- and intra-chip magnitudes in a direct way.
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