{"title":"无封装寄生和有封装寄生信号完整性仿真的IBIS建模技术评价","authors":"Y. Ji, K. Mouthaan, N. Venkatarayalu","doi":"10.1109/EDAPS.2010.5683003","DOIUrl":null,"url":null,"abstract":"Input/Output Buffer Information Specification (IBIS) models are widely used in signal integrity analysis because of their ability to protect proprietary information and to reduce simulation time when compared to full SPICE simulations. Generation of IBIS models with I/V and V/T data from a full SPICE model of a typical digital buffer without and with package parasitics is investigated in this paper. Several different IBIS model generation strategies to incorporate package effects are validated with the full SPICE model in order to provide a suitable approach. In addition, the accuracy of IBIS simulations in HSPICE and ADS is investigated.","PeriodicalId":185326,"journal":{"name":"2010 IEEE Electrical Design of Advanced Package & Systems Symposium","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Evaluation of IBIS modelling techniques for signal integrity simulations without and with package parasitics\",\"authors\":\"Y. Ji, K. Mouthaan, N. Venkatarayalu\",\"doi\":\"10.1109/EDAPS.2010.5683003\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Input/Output Buffer Information Specification (IBIS) models are widely used in signal integrity analysis because of their ability to protect proprietary information and to reduce simulation time when compared to full SPICE simulations. Generation of IBIS models with I/V and V/T data from a full SPICE model of a typical digital buffer without and with package parasitics is investigated in this paper. Several different IBIS model generation strategies to incorporate package effects are validated with the full SPICE model in order to provide a suitable approach. In addition, the accuracy of IBIS simulations in HSPICE and ADS is investigated.\",\"PeriodicalId\":185326,\"journal\":{\"name\":\"2010 IEEE Electrical Design of Advanced Package & Systems Symposium\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE Electrical Design of Advanced Package & Systems Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2010.5683003\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Electrical Design of Advanced Package & Systems Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2010.5683003","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Evaluation of IBIS modelling techniques for signal integrity simulations without and with package parasitics
Input/Output Buffer Information Specification (IBIS) models are widely used in signal integrity analysis because of their ability to protect proprietary information and to reduce simulation time when compared to full SPICE simulations. Generation of IBIS models with I/V and V/T data from a full SPICE model of a typical digital buffer without and with package parasitics is investigated in this paper. Several different IBIS model generation strategies to incorporate package effects are validated with the full SPICE model in order to provide a suitable approach. In addition, the accuracy of IBIS simulations in HSPICE and ADS is investigated.
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