从gan基HEMT直流转移特性估计表面陷阱的一种简单技术

Sujan Sarkar, Ramdas P. Khade, N. Dasgupta, A. DasGupta
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引用次数: 0

摘要

本文提出了一种通过施加负栅偏置应力来估计氮化镓基hemt表面陷阱的简单技术。在漏极电压(VDS)从2V到10V,栅极偏置应力为- 8V时,测量hemt的转移特性。测量的应力时间从0秒到300秒不等,以60秒为步长。对于特定的VDS,随着应力时间的增加,由于表面陷阱的存在,失态漏极电流发生了变化。对两种不同的样品进行了表征。在一个具有大量表面陷阱的样品中,失态漏极电流随着应力时间的增加而减小。在另一个表面陷阱数量可以忽略不计的样品中,失态漏极电流几乎保持不变。这种简单的测量技术可以识别gan基hemt中存在的表面陷阱。通过对具有特殊测试结构的表面陷阱的估计,证实了这一结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Simple Technique to Estimate Surface Traps from DC Transfer Characteristics of GaN-Based HEMT
This paper proposes a simple technique to estimate the surface traps in GaN-based HEMTs by applying a negative gate bias stress. The transfer characteristics of HEMTs were measured for drain voltages (VDS) varying from 2V to 10V in steps of 2V with gate bias stress of −8V. The stress time of the measurement was varied from Os to 300s in steps of 60s. For a particular VDS, as the stress time was increased, the off-state drain leakage current changed due to surface traps. Two different samples were characterized. In one sample with a significant amount of surface traps, the off-state drain leakage current de-creased with the stress time. In another sample with a negligible amount of surface traps, the off-state drain leakage current remained nearly constant. This simple measurement technique can identify surface traps present in GaN-based HEMTs. The results were corroborated through estimation of surface traps with special test structures.
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