应用纳米压痕法表征聚酰亚胺薄膜的粘附强度

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2019-07-01 DOI:10.1109/IPFA47161.2019.8984895

Xiaoxuan Li, Xintong Zhu, Yi Liu, Xiaodong Li, R. Chockalingam, R. R. Nistala, Zhi Qiang Mo

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引用次数: 0

摘要

厚聚酰亚胺层被用作缓冲层，以吸收模塑化合物施加的应力。研究了不同工艺条件下聚酰亚胺厚层的粘接强度。应力是由压痕引起的，通过FIB和SEM成像证实了分层。计算得到的聚酰亚胺薄膜的粘附能最高，约为30 J/m2，在聚酰亚胺薄膜自旋涂覆前，用额外的衬垫保护层nblock(氮掺杂阻挡层，SiCN)等离子体清洁处理的晶圆。

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Application of Nano-indentation method to characterize adhesion strength of polyimide film

Thick polyimide layer has been used as buffer layer to absorb stress imposed by molding compounds for many years. This paper studied the adhesion strength of the thick polyimide layer under different process conditions. The stress was induced by indentation, and delamination was confirmed by FIB and SEM imaging. The calculated adhesion energy for polyimide film was highest, around 30 J/m2, for the wafer processed with an extra pad protection layer Nblok (Nitrogen-doped barrier on top of copper, SiCN) plasma clean before the spin coating of polyimide film.

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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

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