热氧化速率对SiC的传导型依赖性(0001)

Takuma Kobayashi, J. Suda, T. Kimoto
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引用次数: 1

摘要

发现了SiC的热氧化速率依赖于传导类型。在2.0×1016 cm-3 ~ 1.0×1019 cm-3范围内掺杂氮(n型),在2.0×1015 cm-3 ~ 1.0×1019 cm-3范围内掺杂铝(p型),对SiC(0001)进行了氧化,表现出明显的依赖性。对于n型碳化硅,随着掺杂密度的增加,氧化物厚度增加,而对于p型碳化硅,氧化物厚度减少。值得注意的是,在Si氧化的情况下,在如此低的掺杂密度下,导通类型之间的氧化速率差异很小,这种依赖性是SiC特有的。作者推测这种差异源于氧化过程中载流子(电子/空穴)密度的差异,这可以合理地解释Si和SiC之间氧化速率的差异。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Conduction-type dependence of thermal oxidation rate on SiC(0001)
The conduction-type dependent thermal oxidation rate in SiC was discovered. The oxidation was performed for SiC(0001) with nitrogen doping (n-type) in the range from 2.0×1016 cm-3 to 1.0×1019 cm-3, and aluminum doping (p-type) in the range from 2.0×1015 cm-3 to 1.0×1019 cm-3, exhibiting a clear dependence. For n-type SiC the oxide thickness increases for higher doping density, and for p-type the thickness decreases. Note that in the case of Si oxidation, there exists very little difference of oxidation rate between the conduction types in such low doping density, and the dependence is peculiar to SiC. The authors speculate the difference originates from the difference in carrier (electron/hole) density during the oxidation, which can reasonably explain the difference in the oxidation rate between Si and SiC.
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