{"title":"基于宽带测量的数字互联建模","authors":"L. Martens","doi":"10.1109/ARFTG.1999.327361","DOIUrl":null,"url":null,"abstract":"This paper describes a general method to derive broadband SPICE circuit models for digital interconnects and packages. The method starts from measured or simulated S-parameters of the package or interconnects under test. The parameters are extracted with minimal optimization leading to physical values.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Broadband Measurement-Based Modeling of Digital Interconnect\",\"authors\":\"L. Martens\",\"doi\":\"10.1109/ARFTG.1999.327361\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a general method to derive broadband SPICE circuit models for digital interconnects and packages. The method starts from measured or simulated S-parameters of the package or interconnects under test. The parameters are extracted with minimal optimization leading to physical values.\",\"PeriodicalId\":284470,\"journal\":{\"name\":\"54th ARFTG Conference Digest\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"54th ARFTG Conference Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARFTG.1999.327361\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"54th ARFTG Conference Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARFTG.1999.327361","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Broadband Measurement-Based Modeling of Digital Interconnect
This paper describes a general method to derive broadband SPICE circuit models for digital interconnects and packages. The method starts from measured or simulated S-parameters of the package or interconnects under test. The parameters are extracted with minimal optimization leading to physical values.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
