130nm RFSOI技术与开关,LNA和EDNMOS器件集成前端模块SoC应用

Raj Verma Purakh, Shaoqiang Zhang, Rui Tze Toh, J. S. Wong, Gao Wei, K. Chew, R. Nair, D. Harame, J. Watts, T. Mckay
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引用次数: 3

摘要

蜂窝频谱变得越来越复杂,LTE标准中有超过50个频率。为了降低前端模块的成本,交换机已经从III-V PHEMT基础迁移到RFSOI的硅解决方案。虽然许多供应商专注于RFSOI的180nm基础技术节点,但为了解决蜂窝标准的逻辑要求,越来越多的供应商转向更先进的节点。此外,人们对迁移到RFSOI中的SOC解决方案也有浓厚的兴趣。本文提出了一种130nm RFSOI技术,该技术具有高性能、低噪声的体系1.5V NMOS,用于LNA器件,采用新颖的体接触方法,低Ron*Coff NMOS用于天线开关,以及最先进的EDNMOS, fT为38GHz, BVdss为14V,用于集成PA应用。具体结果包括开关,LNA和功率放大器器件的特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 130nm RFSOI technology with switch, LNA, and EDNMOS devices for integrated front-end module SoC applications
The cellular frequency spectrum has become increasingly complex with over 50 frequencies in LTE standards. To reduce costs in the front end module the switch has migrated from a III-V PHEMT base to a silicon solution in RFSOI. While many providers have focused on a 180nm base technology node for the RFSOI there has been an increasing move to more advanced nodes to solution the logic requirements of the cellular standards. In addition there has been a strong interest in migrating to an SOC solution in RFSOI. In this paper a 130nm RFSOI technology is presented with high performance and low noise body tied 1.5V NMOS for LNA devices with a novel method of body contacting, low Ron*Coff NMOS for antenna switch and state of the art EDNMOS with fT of 38GHz and BVdss of 14V BVdss for integrated PA application. Specific results presented include characterization of the switch, LNA, and Power Amplifier devices.
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