65 nm薄盒FDSOI工艺中控制后门偏置的辐射硬布局结构

J. Yamaguchi, J. Furuta, Kazutoshi Kobayashi
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引用次数: 6

摘要

我们提出了一种辐射硬布局结构来控制薄盒FDSOI的后门偏置。具有固定后门偏置的结构对软误差的抵抗能力最强,而在电源和地轨下具有P+和N+扩散的结构对具有后门偏置可控性的软误差的抵抗能力强于不具有P+和N+扩散的传统结构。测试芯片采用65nm体积和薄盒FDSOI工艺制作。α源实验结果表明,扩散结构能有效抑制薄盒过程中的软误差。但在批量生产过程中效果不佳。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A radiation-hard layout structure to control back-gate biases in a 65 nm thin-BOX FDSOI process
We propose a radiation-hard layout structure to control back-gate biases for thin-BOX FDSOI. The structure with fixed back-gate bias has strongest against soft errors, while the structure with P+ and N+ diffusions under power and ground rails makes flip-flops stronger against soft errors with back-gate bias controllability than the conventional structure without P+ and N+ diffusions. The test chip was fabricated by 65 nm bulk and thin-BOX FDSOI processes. The experimental results with α sources reveals that the structure with diffusions is effective to supress soft errors on the thin-BOX process. But it is not effective on the bulk process.
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