实际倒装芯片焊点低周疲劳测量结果

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529970

R. Metasch, M. Roellig, A. Roehsler, C. Boehm, K. Wolter

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引用次数: 0

摘要

本文介绍了在剪切试验装置中用小焊点测量的低周疲劳结果和性能。这些对称三角形实验是在25°C下通过试样位移和焊点材料的变化进行的。位移在2 ~ 8 μm之间变化，应变可达2%，应力可达40 MPa。使用的焊锡球合金有SnAg3.5、snag3.0、cu0.75和SnPb36。应变速率接近1E-2 / s。

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Low cycle fatigue measurement results on real flip chip solder contacts

The paper presents low cycle fatigue results and properties as measured by small solder joints in a shear test setup. These symmetrical triangle experiments were performed at 25 °C by the variation of the specimen's displacements and the solder joint materials. The displacements varied between 2 μm and 8 μm to get strains up to 2 % and stresses up to 40 MPa. The used solder ball alloys are SnAg3.5, SnAg3.0Cu0.75 and SnPb36. The strain rate was close to 1E-2 per second.

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来源期刊

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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