{"title":"电迁移评估- MTF建模和加速测试","authors":"T. Burkett, R. Miller","doi":"10.1109/IRPS.1984.362057","DOIUrl":null,"url":null,"abstract":"Fail times and activation energies were determined to vary widely for different metal compositions. General results indicate that temperature, current density and grain size are the most dominant factors that affect electromigration behavior for the various metal compositions. The technique of using changes in metal stripe resistance to predict the time of failure was evaluated.","PeriodicalId":326004,"journal":{"name":"22nd International Reliability Physics Symposium","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1984-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Electromigration Evaluation - MTF Modeling and Accelerated Testing\",\"authors\":\"T. Burkett, R. Miller\",\"doi\":\"10.1109/IRPS.1984.362057\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Fail times and activation energies were determined to vary widely for different metal compositions. General results indicate that temperature, current density and grain size are the most dominant factors that affect electromigration behavior for the various metal compositions. The technique of using changes in metal stripe resistance to predict the time of failure was evaluated.\",\"PeriodicalId\":326004,\"journal\":{\"name\":\"22nd International Reliability Physics Symposium\",\"volume\":\"62 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1984-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"22nd International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1984.362057\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"22nd International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1984.362057","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electromigration Evaluation - MTF Modeling and Accelerated Testing
Fail times and activation energies were determined to vary widely for different metal compositions. General results indicate that temperature, current density and grain size are the most dominant factors that affect electromigration behavior for the various metal compositions. The technique of using changes in metal stripe resistance to predict the time of failure was evaluated.
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